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Our Nanofabrication facility offers industry-compatible processing with a range of standard options, including 150mm and up to 200mm wafer processing. Our lithography capability combines photo- and electron beam lithography down to 20nm with nano-imprint and Hot Embossing as well as direct patterning using the Focused Ion Beam (FIB).
Self-assembly fabrication of nanostructures is used to grow carbon nanotubes, semiconductor nanowires and quantum dots. Ultra-thin film deposition can be performed by atomic layer deposition or by PECVD for example to fabricate a range of IV/IV materials (Si, Ge, SiGe) and novel metal oxides.
Deposition of high quality low loss optical layers are possible using Plasma Assisted Reactive Magnetron Sputtering and multi-stack devices can be constructed using wafer-to-wafer aligning and bonding using anodic, thermal compression and polymer methods.
We offer device fabrication using a wide range of materials and processes for silicon electronics, photonics, MEMs, Lab-on-a-Chip, and spintronics. One-off device/circuit fabrication or small volume production runs can be catered for.
Our combined fabrication/characterisation capability includes dual Focussed Ion Beam with integrated SEM and SIMS. The many other measurement tools available include ellipsometry, XPS, Raman spectroscopy, cryogenic prober, RF measurements up to 60GHz,Field-Emission Scanning Electron Microscopy (FESEM), a range of AFMs and a Helium Ion microscope, the capabilities of which are being developed in collaboration with Zeiss.
Our expert technical and academic staff closely work with a range of partners to meet their specific device and materials fabrication requirements.
Find out more about our full range of nanofabrication services.